Proven Solutions for Interconnection

Our company offers a wide selection of burn-in sockets for various device packages, from Lead packages to ball packages, these burn-in sockets support thermal and electrical stress testing of IC packages with cost effectiveness, quick lead time and high level of quality certification. To meet customers’ growing challenges and to keep up with package development, especially smaller IC size with more I/O, we provide fine-pitch solutions and small outlines of sockets, giving customers more and more satisfaction in IC testing!